Over the last 50 years
microelectronic advances
have transformed our experience and lifestyle.

From box televisions to ultra-thin curvy high-resolution displays, from brick phones to slick mobile phones and smart watches, electronic devices are becoming increasingly light-weight, conformal and more intimately integrated with us. Flexible electronics are emerging over the last decade to enable this evolution in form factor. Rigid electronics like Silicon Chips have evolved to be ultra small, ultra energy efficient, and fast. On the other hand, ink-printed electronics enables low-cost components in large-area format (e.g. paper, plastic, elastomers) to enable new form factors and interactivity with us and the environment. An exciting emerging field of hybrid flexible electronics where printed and rigid semiconductor technologies, combine to overcome their respective limitations, is gaining traction and generating new innovative applications.

The Hybrid Integrated Flexible Electronic Systems (HiFES) program is an initiative by NUS and Faculty of Engineering to spearhead innovations in hybrid flexible electronics. It proposes system approaches to flexible electronics by integrating materials, device fabrication, and design through co-design. This brings together multi-disciplinary expertise across the campus with clear goals towards realizing more functionally capable devices.

Message from the Director

The emergence and evolution of flexible electronics presents an exciting time for NUS and Faculty of Engineering, a time of change and opportunity. We are excited to start a new multi-team research program to explore and innovate in Hybrid Flexible Electronic Technologies. The mission of The Hybrid Integrated Flexible Electronic Systems (HiFES) program is to push the frontier of the technology to address three broad areas of application: smart human machine interfaces and wearables; autonomous robotics; as well as diagnostic and medical applications. Today we have 15 leading professors in the NUS HiFES program. Their interdisciplinary teams are engaged in research projects that span ultra-low power circuit design, RF, Wearables, Energy, and Hardware Security utilizing Hybrid Flexible Technologies. We continue to seek new collaborations to enrich the research work and find opportunity to translate the technology for societal impact. We also welcome industry partners to join our consortium to work closely with us to develop disruptive cutting-edge applications for commercialization. We appreciate your interests and look forward to your participation.

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Together with our partners, we work towards realizing more functionally capable device for better lives!

Academic Partners

Faculty of Engineering

  • Department of Electrical & Computing Engineering
  • Department of Biomedical Engineering

Faculty of Sciences

  • Centre for Advanced 2D Materials
  • Organic Nano Device Laboratory

Research Institutes

  • Temasek Laboratories

School of Computing

Industry Partners