From box televisions to ultra-thin curvy high-resolution displays, from brick phones to slick mobile phones and smart watches, electronic devices are becoming increasingly light-weight, conformal and more intimately integrated with us. Flexible electronics are emerging over the last decade to enable this evolution in form factor. Rigid electronics like Silicon Chips have evolved to be ultra small, ultra energy efficient, and fast. On the other hand, ink-printed electronics enables low-cost components in large-area format (e.g. paper, plastic, elastomers) to enable new form factors and interactivity with us and the environment. An exciting emerging field of hybrid flexible electronics where printed and rigid semiconductor technologies, combine to overcome their respective limitations, is gaining traction and generating new innovative applications.
The Hybrid Integrated Flexible Electronic Systems (HiFES) program is an initiative by NUS and Faculty of Engineering to spearhead innovations in hybrid flexible electronics. It proposes system approaches to flexible electronics by integrating materials, device fabrication, and design through co-design. This brings together multi-disciplinary expertise across the campus with clear goals towards realizing more functionally capable devices.